The following machine Specification Sheets are available.

Automated Test Equipment:


HP-Agilent 3070 Series
Teradyne 1890
Genrad 2287

PCB Assembly Equipment:

DEK 265 GSX - Screen Printer
Electrovert Electra - Wave Solder
Fuji CP6-4000 - Chip Shooter
Fuji CP6-42 & 43 - Chip Shooter
Fuji IP3 - High Speed Placement
MPM UP2000 - Screen Printer
MPM UP3000 - Screen Printer
Universal GSM II - Component Placer
Universal RAD 5 - Component Placer
Universal RAD 8 - Component Placer
Vitronics XPM - Reflow Oven